Murali Annavaram, assistant professor in our department, has been awarded a Faculty Early Career Development (CAREER) grant by the National Science Foundation (NSF). This prestigious award supports the early career-development activities of faculty who most effectively integrate research and education within their academic institutions.
Prof. Annavaram's project is entitled: "From Nonstop-Monitoring to Nano-ISA: An Adaptive Multi-Dimensional Framework for Processor Reliability." The research addresses the challenges of processor reliability in current and future silicon integrated circuit technology. Although computer system performance continues to increase while costs decrease, shrinking device sizes have recently led to new challenges in system reliability. Rather than addressing a single reliability concern, such as soft errors or process variations, Prof.
Annavaram takes a multi-dimensional approach to improve Mean-Time-To-Failure (MTTF). His work focuses on error monitoring, detection and correction in a hierarchical framework based on reliability needs, and describes several design and software solutions to address these problems. The results of this work are broadly applicable to enhanced computing, ranging from high performance systems to the commodity and consumer level.
Prof. Annavaram received the B.Tech. degree in computer science from the National Institute of Technology, Warangal, India in 1993, the M.S. in computer science and engineering from Colorado State University in 1996, and the Ph.D. in computer science and engineering from the University of Michigan in 2001. He was a senior research scientist at Intel Microprocessor Research Lab (MRL) in Austin, TX from 2001 through 2007, and a visiting faculty researcher at the Nokia Palo Alto Research Center in 2007. He joined USC in 2007, and is now assistant professor and a member of the Computer Engineering division of the Ming Hsieh EE Department. Dr. Annavaram's research interests are in computer and mobile platform architectures, very-large-scale-integration (VLSI) design, 3D stacking, wireless systems and networks.